Does anyone know that the IPC-7095 is being published or not? The following infor is almost 1 year old: "New IPC-7095 covers this topic (Design and Assembly process implementation for BGA's). You can down load it from their web site. It is in final draft at present time." jk >Date: Fri, 04 Aug 2000 21:54:19 -0400 >To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask] >From: joyce <[log in to unmask]> >Subject: Re: [TN] BGA Pad Size > >1999 IPC has a draft of BGA design and manufacturing doc. in the works...Does anyone know the status of the document? > jk >At 08:48 PM 8/4/00 EDT, you wrote: >>In a message dated 8/4/00 5:59:16 PM EST, [log in to unmask] writes: >> >><< TechNet Designers, >> >> I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific >> on BGA pad guidelines. >> I see in the IPC Technical Info book that there is an amendment 2 that >> addresses BGA pad design. >> >> While I am getting that amendment ordered, is there any standard "rule of >> thumb" for pad size >> relative to ball diameter on 1.27m and 1.0m BGA's that should be followed, >> or that you have found to be >> useful in designing boards with BGA devices? >> >> Thanks for your help and opinions. >> >> Regards....DT >> >> >>Hi Darrel, >> >>Just as Jeff said, Motorola's AN1231 app notes is pretty good, but he didn't >>say where you could get it. Go to: >> >>http://mot-sps.com/cgi-bin/get?/books/apnotes/pdf/an1231*.pdf >> >>Just tryin' ta' help... >> >>-Steve Gregory- >> >>############################################################## >>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >>############################################################## >>To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >>the body: >>To subscribe: SUBSCRIBE TECHNET <your full name> >>To unsubscribe: SIGNOFF TECHNET >>############################################################## >>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >>information. >>If you need assistance - contact Keach Sasamori at [log in to unmask] or >>847-509-9700 ext.5315 >>############################################################## >> > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################