Hello Technetters, We are designing a Printed Board Assembly that will be required to operate in an ambient temperature up to 100 degrees Centigrade. There have been concerns expressed about the strength of solder joints at that temperature. Could anyone share any of their experiences using conventional solders and FR4 materials for similar applications. (this is not aerospace stuff, just gets very hot when it is working in a warm location.) Would standard solder pastes be satisfactory for this application, or are there any suggestions for the use of a higher temperature solder. Also, would the high temp solders present a problem for the assembly shops? regards, Phil. Phil Dutton C.I.D. Senior CAD Technician IPC Certified Interconnect Designer Tenix Defence Systems Pty Ltd Systems Division - Adelaide Second Avenue, Technology Park, Mawson Lakes. SOUTH AUSTRALIA 5095 ================================ Phone: (08) 8300 4400 (reception) Fax: (08) 8349 7420 email: [log in to unmask] Internet Page: http://www.tenix.com ================================ ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################