Hey Ryan,

For most applications, manual de-paneling is fine.  If the score depth is correct, very
little stress is produced at the demarcation.  However, there are conditions, such as
surface mount components adjacent to the score line (as you mentioned), and arrays that
contain many small parts, that lend themselves to mechanical de-paneling.  You are
correct in your assumption that no stress is placed on the line when using the pizza
cutter style de-panelers.
hope this helps,
Mark Simmons, Vscore Central

Ryan Jennens wrote:

> Hey all-
>
>         In an earlier thread, there was some discussion that separating v-scored
> boards can cause bending stress that my crack ceramic capacitors that are
> too close to the board edge.  If the boards are separated with a "pizza
> cutter" style separator, and the blades are perpendicular, where does this
> stress come from?  My thinking is that if the pressure is straight down onto
> the lower blade, how is board bending created?
>
> -Ryan Jennens
> TelGen Corporation
>
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