Hey Russ, What about those of us that are still there....we're still successful in plating up from 2 to 4... Yes it takes effort, panel alignment, chemistry monitoring, process control, and well designed panels but I would dare say it's no more difficult then the majority of the work we do...again, controlling the processes is key... Franklin Russ Bafford wrote: > > Steve, > > Once upon a time the bare board house I used to work for was making a 4 oz. > finished board. We tried plating 2 oz. up to 4 oz. We were not able to get > our plating uniform enough to produce a consistent 4 oz. copper surface. > > Take if from someone who has been there; do whatever you have to in order to > get 3 oz. material to start with. > > Russ Bafford > Sovereign Circuits > 330-538-3900 > > -----Original Message----- > From: Steve Collins <[log in to unmask]> > To: [log in to unmask] <[log in to unmask]> > Date: Friday, July 21, 2000 4:56 PM > Subject: [TN] 3 oz material > > >Are there any reliability concerns in requesting a 4 oz board to start with > >2oz base material and plate up the extra 2 oz with plated copper over > >starting with 3 oz base material and plating 1 oz for a 4 oz finished > >product. > > > >At this point I'm not as interested in comments on price since I realize > >the cost difference and availability issues involved here. > > > >Steve Collins > > > >############################################################## > >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > >############################################################## > >To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in > >the body: > >To subscribe: SUBSCRIBE TECHNET <your full name> > >To unsubscribe: SIGNOFF TECHNET > >############################################################## > >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > >information. > >If you need assistance - contact Keach Sasamori at [log in to unmask] or > >847-509-9700 ext.5315 > >############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################