Hello technetters, I'm having a strange problem at my new digs. We have an outer-arrayed 256 pin BGA going on a 6 layer FR-4 board. Everything is standard. The problem is the rework. We have a Conceptronic station and the nozzle we are using does not fully encapsulate the component. It always stays about 1/8" off the board. Therefore, I am not getting full underside airflow. The techs are using extremely high temperatures to get the component to reflow. I am wondering this: if I run a standard profile (using previous BGA reflow experience) and the part won't even begin to reflow, can I chalk it up to the airflow problem. I am guessing that the reason that using abnormally high temps is reflowing the part, then it's only happening by conduction through the part, not proper heat getting under it. Also, in this regard, if I'm only reflowing by conduction through the part, then what's happening to the integrity of the part? Please help. Jason Gregory ACT Manufacturing-Production Supervisor Corinth, MS. (662)287-3771 x470 [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################