no sweat. Unless the component is made out of alumina or has a heatsink slug, it will easily stay on the board by surface tension alone. (I have never seen a TSOP made out of alumina or with a heat sink. But never say never!) Thanks Ryan Grant Advanced Technology Engineer MCMS (208) 898-1145 [log in to unmask] > -----Original Message----- > From: Justin Braime [SMTP:[log in to unmask]] > Sent: Thursday, July 06, 2000 4:03 PM > To: [log in to unmask] > Subject: [TN] Component weights for double-sided reflow > > Hi All, > Can anybody tell me if it is possible to perform double-sided reflow with > TSOP 28T or 32T components on the bottom-side? > I could work it out myself if I could only find the component weights! > The prouct is at the design stage, so I don't have any components I can > weigh :-( > > Thanks in advance! > > Justin Braime > Compuspec Industries Ltd > Auckland, New Zealand > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################