"NOTE: The information in this e-mail is confidential and may be legally privileged. If you are not the intended recipient please notify the sender immediately and then delete this e-mail. You must not read, copy, use or disseminate this e-mail or any information in it . Although this e-mail and any attachments are believed to be free of any virus or other defects which might affect any computer or IT system into which they are received, no responsibility is accepted by Laporte plc or any of its associated companies for any loss or damage arising in any way from the receipt or use thereof. Any opinions expressed in this e-mail or any attachments are those of the individual sender and not necessarily the Company." " Peter, How does one blame the plating on this issue? The fabricator has nothing to say about board design, which has a major effect on overplating. Without sectioning, we can't say anything about overplating at this time,. With respect to what looks like thin mask over the trace, that to should be determined with sectioning. In most cases that I have seen, a pseudo thin mask area actually is a pull back of the pigment of the mask, not the mask itself. As far as debubbling goes, that may be true for curtain coating of the mask. In screenable LPI and Spray, the flash off (tack dry) is a very critical step in eliminating bubbles. Best regards, Mike Carano -----Original Message----- From: Peter Menuez [SMTP:[log in to unmask]] Sent: Thursday, July 27, 2000 6:48 PM To: [log in to unmask] Subject: Re: [TN] "Bubbly Soldermask..." First of all the pictures you show look pretty bad and I don't believe I would ever ship something like these. However, I want to point out that these may not be 'rejectable'. After coating LPI there is a hold time to allow the mask to debubble. This debubble time varies on many things but primarily on the thickness of the copper trace. Think about the geometry of the trace. If the trace was 1oz (.0014") the mask would cover fairly evenly and there would be little or no mask build up at the trace. At the trace thickness increases the trace acts as a dam forcing the mask to build up along the trace. This is exactly what you are showing in the pictures. The fact that the mask is very thin (most pigment removed) at the top of the trace is a good indicator that there is high copper here.) The debubbling hold time is designed to allow the volatiles (solvents) to escape the mask. What it looks like in your picture is that the boards were not debubbled long enough before they were tack cured. What you have left are small dots where the solvent was forced out of the mask leaving behind a puddle of mask. I have done a considerable amount of cross sectioning on this anomaly and have yet to find a void in the mask. I glanced over several of the emails responding to your original question and suggest that contamination, curing, moisture etc. are based on peoples inexperience with LPI's. This is a classic debubbling issue. I said in my opening statement that these boards may not be rejectable. They are rejectable for the simple reason that they are ugly but probably not rejectable for performance issues. If you cross section these puddles you will see that there is more mask present (rather than less which would be the case with a void). If you have more mask you have more insulation and in fact your insulation performance would be increased. Ok, this is pretty weak but... The area I would concentrated on with your supplier are: a) control of the plating process and b) if there is anything you could do to help them control the plating (robber buss/thief area) pete menuez [log in to unmask] --- Brian Ellis <[log in to unmask]> wrote: > Steve > > This is incredible. Change your supplier as top > priority :-) Seriously, as the others > say, the "bubbles" are probably due to solvent/water > entrapment in the track corners. > However, I see another problem which may/may not be > related. Am I correct in thinking > that it has been hot and humid where you are, > lately? If so, it would seem that there > has been hygroscopic contamination left on the > board. On your first photo, see the > myriad white points between the tracks? This looks > like vesication to me. The most > common cause is hygroscopic contamination (ionic or > non-ionic) which pumps atmospheric > humidty across the mask layer (all polymers can > allow humidity through). The osmotic > pressure rises until it actually lifts the mask off > the surface, locally, forming a > vesicle or, if you like, a microblister (see my book > for detailed explanation). This > could possibly be the cause of your bubbles along > the track edges, as well, although > these seem rather gross: the photo I use to > illustrate vesication also has bubbles > along some of the track edges, but the vesication > between the tracks is on a similar > scale. Whatever, it is a totally unacceptable fault. > > Brian > > "Stephen R. Gregory" wrote: > > > Hi all! > > > > We just got some boards in at receiving inspection > that have thousands of > > little "bubbles" in the soldermask all over the > boards...they seem to > > concentrate all along the edges of the features of > the board. You can see > > pictures of it at: > > > > > http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures > > > > One picture is bubblemask.jpg, the other is > bubblemask2.jpg...what would > > cause that? It's a LPI...don't know the brand > name. I'm thinking that either > > the boards weren't dry or cleaned well prior to > soldermasking them. I'm > > rejecting the boards of course... > > > > My freedrive is filling up fast with all the > pictures of the "pretty boards" > > that we get from our vendors!!! > > > > -Steve Gregory- > > > > > ############################################################## > > TechNet Mail List provided as a free service by > IPC using LISTSERV 1.8c > > > ############################################################## > > To subscribe/unsubscribe, send a message to > [log in to unmask] with following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > > ############################################################## > > Please visit IPC web site > (http://www.ipc.org/html/forum.htm) for additional > > information. > > If you need assistance - contact Keach Sasamori at > [log in to unmask] or > > 847-509-9700 ext.5315 > > > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC > using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to > [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site > (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at > [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## __________________________________________________ Do You Yahoo!? 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