Ken mentions: > Reliability/Quality Expert, > How can I select the thermal stress/shock profile for loaded board if I want > to precipitate the fab problem. Boards are functionally passed but belongs > to suspect date code. > > I am looking for a profile in the following format. Hi Ken, Before you do any testing, a good, root cause failure analysis is required before specifying a failure acceleration method. Once you've conclusively identified the specifc cause of your module failure, you can tailor a stress test to weed out that specific problem (or fix the root cause failure reason, better yet!) Without the root cause failure identified, you may end up spending a lot of money, and potentially ruining a lot of good modules doing accelerated life/reliability testing, with minimal return. Rgds John -=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=- John Brewer Supervisor, Component Engineering Raleigh, NC (919)-266-8870 [log in to unmask] -=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################