Hello all: We're using Coffin-Manson equation to calculate the acceleration factor (AF)of solder joint. The failure mechanism is thermal fatigue. The only stress taken into account in the equation is temperature range. I have a question: is it possible to include the temperature transition rate in that equation? And what's the relationship between AF and temperature rate? Thanks a lot! Ruby ________________________________________________________________________ Get Your Private, Free E-mail from MSN Hotmail at http://www.hotmail.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################