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Hi Barry!
 
I can answer the last one.  Check out http://www.ipc.org/html/fsresources.htm
and follow the links.
 
Good luck!
 
Hans
 

~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Materials (Process & Manufacturing) Engineer
Warner Robins Air Logistics Center
Avionics Production Division
Manufacturing Branch
380 Second Street, Suite 104
Building: 640, Mail Stop: LYPME
Robins AFB, GA 31098-1638
Voice: (912) 926 - 1970 Fax: (912) 926 - 7164
mailto:[log in to unmask]
http://www.robins.af.mil

-----Original Message-----
From: Barry Gallegos [mailto:[log in to unmask]]
Sent: Wednesday, June 21, 2000 4:08 PM
To: [log in to unmask]
Subject: [TN] White Emersion Tin?

Hello again TN’s

 

Trying to learn.

 

My question goes to White emersion tin.

  1. Is it my imagination? Or does fine pitch soldering appear to be insufficient at first when you go from HASL to white tin. There for is it necessary to change the stencil thickness.

  2. Are there any concerns that I should be aware of where profiling is concerned, due to a lack of HASL, the pad coverage does not seem to want to wet out away from the toe. Is this a by product of not having HASL.

 

 

 

Lastly, how does one access the archives to do research on issues that have been discussed?

 

 

 

Thanks in advance.

 

Barry Gallegos\

Western Electronics

208-377-1557