Jurgen, The one that I am familiar with is an ERSASCOPE. It operates in a similar fashion as what you described. However, a fiber optic cable does not go underneath the component as you suggested. You look under a component via a series of prisms. Looking at the internal solder balls (behind the outside perimeter solder balls) is feasible but may be difficult. 2 websites that have some information on it are: http://csitechnet.com/ and http://www.ersa.com/. Another system is the Caltex 3-D Hi-scope and BGA scope. Their website is: http://www.hi-scope.com/. Manncorp does offer visual inspection systems. Their website is: http://www.manncorp-smt.com/. Lee Whiteman Senior Manufacturing Engineer ACI / EMPF Telephone: (610) 362-1200; Ext. 208 FAX: (610) 362-1290 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jurgen Kruger Sent: Friday, June 02, 2000 11:22 AM To: [log in to unmask] Subject: [TN] Other visual tests under a BGA possible? Dear Members! With interest I follow your discussion about X-ray testing of BGAs. I would like to know, are there any other visual tests possible, to look under a soldered BGA? For example, with a very tiny camera using a glass-fibre-cable, say 0,5mm diameter? Is something like this in use? Or makeable? Would need a very tiny optical system? I got the impression, to solder BGAs reliable is a very delicate thing, isn't it? Sorry for my stupid statements, but I haven't any experience in BGAs nor testing of PCBs. Jurgen. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################