Alexis - I'm not sure I understand the reason for the note you were asked to add, since with reflow soldering you will get up to about 230 degrees C, and with wave soldering you will hit about 260 degrees C. Anyways, as far as substituting Dry Film for LPI, I honestly can't think of a single good reason to do that. The cracking, in LPI is new to me, maybe it was one "brand" of LPI that was improperly applied by the fabricator. I know when LPI first came out, there were a number of problems with different manufacturers, but I'm not aware of any current cracking problems. If you get the information, please post it to TechNet so we can all understand the situation. I would suggest in the interim, you try to get more detailed information and justification before you switch because of the additional difficulties you may have with dry film. Ed Valentine Electronics Manufacturing Solutions 8612 Mourning Dove Road, Raleigh, NC 27615 Phone: (919) 270-5145, Fax: (919) 847-9971 Email: [log in to unmask] Website: http://www.ems-consulting.com ----- Original Message ----- From: Alexis Meehan <[log in to unmask]> To: <[log in to unmask]> Sent: Monday, June 19, 2000 1:06 PM Subject: [TN] PCB Materials/Soldermask > For NEBS compliance, we have been advised by a consultant to add this > note to our fab drawings: > * Material must be thermal resistant to 150 degrees C. > We have also been advised to switch from LPI soldermask to dry film to > resist cracking which has been seen to happen after a few years. > What are your experiences with these 2 issues? Do we really need to do > this? I'm concerned about needlessly adding cost to our fabs. Any feedback > would be appreciated. > > ******************** > Alexis Meehan > [log in to unmask] > LuxN, Inc. > 570 Maude Court > Sunnyvale, CA 94086 > "The Optical Renaissance Has Begun." > http://www.LuxN.com > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################