I think we are all going to agree with you Bill Ryan Grant > -----Original Message----- > From: Brooks Bill [SMTP:[log in to unmask]] > Sent: Thursday, June 08, 2000 4:04 PM > To: [log in to unmask] > Subject: Re: [TN] still confused > > That's Different! He's absolutely correct! The gold plating in THAT area > would be desirable, this is no different than a card edge connector. If > the > pad on the board is to act as a connector and they will NOT be soldering > to > it, I would highly recommend a gold over Ni surface. To rework, can you > strip the solder from the pads and selective NI/gold plate there... and > still protect the circuitry and components from contact with the > chemicals? > One alternative might be silver plating.... silver oxide is still very > conductive... but I don't know if it's an option for the company you are > dealing with... > > The risk of corrosion degrading the battery performance has to do with the > contact of the battery to the pad on the board. Humidity in the air can > condense between the nickel plating on the outside of the battery and the > Tin/lead solder on the surface creating an electrolyte between dissimilar > metals.... thus oxidation and corrosion will seep into the contact area > over > time, reducing the conductivity between the battery and the board. > > > Bill Brooks > Senior PCB Designer - [log in to unmask] <mailto:[log in to unmask]> > > Zoneworx, Inc. > 40925 County Center Drive, STE 200 > Temecula, CA 92591 > http://www.zoneworx.com <http://www.zoneworx.com> > Tel: (909) 296-1226 x 1037 > Co-Director / Education Officer / Webmaster > for the San Diego Chapter of the IPC Designers Council > http://www.ipc.org/SanDiego/index.html > <http://www.ipc.org/SanDiego/index.html> > > > > > > > -----Original Message----- > From: Ralph Richart [mailto:[log in to unmask]] > Sent: Thursday, June 08, 2000 2:33 PM > To: [log in to unmask] > Subject: Re: [TN] still confused > > > So here's the deal: > > They have two large circular pads (like about .750") that they use as > battery > contacts. He says that this is the place that he has corrosion risk. I > can't tell if > the corrosion risk is from battery leakage or environmental effects. > Anyway, he says > that corrosion significantly impacts the battery life. > > ralph > > David Hillman wrote: > > > Hi Ralph! Can you provide more information on what the customer > > considers/experienced "corrosion" and what type of use environment > he/she > > was talking about? > > > > Dave Hillman > > Rockwell Collins > > [log in to unmask] > > > > Ralph Richart <[log in to unmask]>@IPC.ORG> on 06/08/2000 11:55:26 > AM > > > > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please > respond > > to Ralph Richart <[log in to unmask]> > > > > Sent by: TechNet <[log in to unmask]> > > > > To: [log in to unmask] > > cc: > > > > Subject: [TN] still confused > > > > We have answers.... > > > > So I had a long talk with my customer this morning to provide input > > based on the invaluable advice from you all. > > > > I said - "is there a specific reason for choosing 3-8u" of immersion > > gold over tin/lead solder?" > > He said - "absolutely, the gold provides corrosion resistance, the gold > > does not" > > I said - "even such a thin amount - only 3-8u"?" > > He said - "definitely, all we need is the coverage, the thickness is > > irrelevant" > > > > Is this true? > > > > Needless to say, we are rebuilding the parts as we speak. Rework sounds > > difficult to say the least, although I may try to come up with some > > scheme for fun as they have a bunch of boards that are no good right > > now. > > > > thanks for all the help..... > > > > ralph > > > > ############################################################## > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > > ############################################################## > > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > ############################################################## > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > > information. > > If you need assistance - contact Keach Sasamori at [log in to unmask] or > > 847-509-9700 ext.5315 > > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## > << File: Bill Brooks.vcf >> ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. 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