Ralph, Do they need Immerison Au surface for a wire bonded chip on board? If so, I would suggest using a very small interface board for the chip instead of trying to plate on a built up board... I would rather walk a mine field in Bosnia, less unknowns and gottchas. Regards, Bruce Misner > ---------- > From: Ralph Richart[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Ralph Richart > Sent: Wednesday, June 07, 2000 7:28 PM > To: [log in to unmask] > Subject: [TN] Loaded board rework > > Hello: > > Our customer made a mistake on their print. Instead of specifying > immersion gold, they specified Hot Air Solder Levelled. Now they have > LOADED boards that they want to get immersion gold on. > > Has anyone done this? The questions I have off the top of my head are: > 1. How do you protect the components from the immersion gold? Would > conformal coat work? > 2. Do you have to strip the solder first, or can you go gold over > solder? > 3. What, if anything, would all this do to reliability? > > Thanks for your help.... > > ralph richart > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################