Yuan, The SUNY (Binghamton) members of the Universal Instruments led research consortium have done a lot of work on this. However, the current data is only for consortium members. Older data is sometimes published as papers in the open literature. Seeing as you are from a university they may offer a certain amount of help to you, a non-member. But you have to talk to the consortium, I can't speak for them. I can't find the business cards for the overall consortium leader or the prime SUNY researcher for this aspect of the consortium's work, so here are the particulars for the Manager of the CSP portion of the consortium: Anthony Primavera Universal Instruments Corporation 607-779-5203 [log in to unmask] regards, Bev Christian XLTEK -----Original Message----- From: LI YUAN [mailto:[log in to unmask]] Sent: Tuesday, June 27, 2000 5:33 PM To: [log in to unmask] Subject: [TN] Flip chip underfill delamination Have anyone successfully modeled underfill delamination using Finite Element modeling? We are looking for building our own internal flip chip component level modeling capability and need help. Please contact me via email or @ (408)544-7508. Regards, Yuan Li ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################