Phil, We have an application where we have a coil contact spring which must be soldered to a brass washer for a High Voltage connection. Our method of success was to use stainless steel spring stock and plate it with electroless nickel. A side note, we had to switch from BeCu spring stock to stainless steel because the BeCu was loosing it's spring strength when we were soldering it to the washer. Hope this helps. Phil Nutting Mfg. Eng. Kaiser Systems, Inc. -----Original Message----- From: Phil Bavaro [mailto:[log in to unmask]] Sent: Tuesday, June 13, 2000 1:47 PM To: [log in to unmask] Subject: [TN] BeCu with bright tin finish solderability Can someone tell me if there is a better way to call out a solderable material finish for a simple formed spring finger which is intended to be soldered using standard solderpaste/reflow processing? These are very similar to emi gasketing for doors, but I've never had to solder them down before. "Material: 0.003" thick Beryllium copper (BeCu) alloy 25 per ASTM B194. Finish: Bright Tin per Mil-T-10727." I don't have a lot of familiarity with either spec and need to know what the rest of the industry would use in this situation. I'm a little concerned about the use of the MIL Spec and also the wetting to the exposed edges of beryllium copper as the springs will be made in bulk and then singulated after plating. These will function as the grounding contact between a board and a chassis. Thanks, Phil ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################