Hi Technetters,

Recently, I have attached GaAs die on a CVD diamond substrate using 80/20
Au/Sn eutectic preform.  After the die bonding at 280 C, we found cracks
(mostly 90 degrees and 45 degrees cracks) on the surface of the GaAs during
the inspection.  We suspect that it is due to TCE mismatch or thermal
shock.  We are thinking about using different die attach material that
requires lower temperature process.  Anyone has advise, suggestion, or any
experience similar to this?  Thanks.


Jong S. Kadesch
Sr. Engineer
NASA-GSFC/Orbital Sciences Corp.
562/Component Technologies and Radiation Branch
Greenbelt, MD 20771
tel:(301)286-2785
fax:(301)286-1695

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