Technetters, We have a customer that is touching up the assembly after wave solder. This touch up is to improve the aesthetics on holes which have not completely wicked up on the lead. We have explained to him that this isn't necessary and he is probably doing more damage than good, however this isn't the issue. The issue is that when he pulls the soldering iron away from the hole the solder appears to fall through the hole and wick on the component lead on the opposite side. We have done cross sectional analysis to ensure the holes aren't voided and the solder isn't being pulled in. Sections look good with a consistent ounce of plating in the holes. I am unsure of what the hole sizes are that he's having problems with, but obviously something is awry with the solder "falling out". Any ideas on what cause may be? Thanks in advance for your help. Jim Gilbert Electronic Circuits & Design Sebring, Ohio ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################