Ed, I have never tried a return-to-web panel on SMD assembly. We have processed boup coup CEM-1, single-sided, through-hole panels. Sometimes the individual PWBs are not pressed back completely flush with the web. This is probably not going to cause you a problem at placement. Stencil printing could be a problem, depending on which side you are going to populate. If the individual boards sit a little high - probably no big deal. If the boards sit below the web, printing could get ugly, as in extra paste getting deposited and turning into the odious solder short. Another problem might be the bow. Typically this type of panel bows. The more individual boards that punched out of a panel - the more the bow. After punching the board is slightly bigger and the hole is slightly smaller, because punching does not leave a clean line of separation. When the board is returned to the web, its like putting 6 lb.. [2.72 kg] in a 5 lb.. [2.27 kg] bag and things start bulging. Just some thoughts, Gary Camac Ed Holton wrote: > Is it possible to print, populate and reflow a punch and return style PCB. > > Ed Holton > Manufacturing Engineer and Group Leader > Hella Electronics > Telephone (734) 414-0944 > Fax (734) 414-0941 > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ##############################################################