TechNetters,
I 'd like to confirm about "Section 2.6-ENVIRONMENTAL TEST METHODS" of
IPC TM-650 Test Methods Manual"
2.6.6B Temperature Cycling, Printed Wiring
Board--12/87
2.6.7A Thermal Shock and
Continuity, Printed Board--8/97
2.6.7.2A Thermal Shock,
Continuity and Microsection, Printed Board--8/97
2.6.8D Thermal Stress,
Plated Through-Holes--3/98
Are these methods latest
versions?
If it is old version, Could you send me new
one?
Any input would be greatly
appreciated.
Best regards,