TechNetters, I 'd like to confirm about "Section 2.6-ENVIRONMENTAL TEST METHODS" of IPC TM-650 Test Methods Manual" 2.6.6B Temperature Cycling, Printed Wiring Board--12/87 2.6.7A Thermal Shock and Continuity, Printed Board--8/97 2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97 2.6.8D Thermal Stress, Plated Through-Holes--3/98 Are these methods latest versions? If it is old version, Could you send me new one? Any input would be greatly appreciated. Best regards, TRI E-Mail: [log in to unmask]