Dear All, apologies if this question has been raised before. We are currently looking into running a 0.5mm thick double sided PCB (142mm wide) down one of our SMD lines, but do not want to use carriers as we are in a medium to high volume production environment and do not want the inefficiency of manually inserting and removing PCBs. Does anyone have any advice on how to go about this? We can design new vacuum supports for our placement machines and modify the locating pin type clamping mechanism so that it does not bow the PCBs upwards, but I cant figure out how to stop excessive sag on the PCBs during reflow. Also how about machines which use edge clamping for the PCBs - we can ease the pressure of the clamping back to stop board bowing but wont the clamping force then be too low and allow the PCB to move? For background info, the line consists of a Dek 265Lt, Fuji CP4-3, Philips Gem series machines (or Yamaha YV100, YVL88, YVL80), and a Heller 1500 reflow oven with pin and mesh conveyor. Any replies will be most appreciated ! Thanks, Chris Murphy, Production Engineering Dept., Tait Electronics ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################