Mike Was this gold-on-gold bonding, aluminium or what? I'm not an expert on plasma cleaning, but I was given to understand that an oxidising gas is used which converts organics to CO2 and H2O. As O, as opposed to non-ionised O2, is a violently reactive substance, this reaction occurs easily, but, equally, M + O > MO (where M is a base metal). Or am I up the pole? Brian Michael Fenner wrote: > I was peripherally involved in this some years ago with a company looking to improve wire > bonding and cleanliness generally. A half an eye was kept on solderability "just in case." > They noted that the type of plasma cleaning, had a noticeable effect on whether surfaces became > more or less wirebondable, but where the work became more bondable there was no change in > solderability. We put this down to the fact that whether there was a little oxide, non or a > lot the flux had more than adequate capability to remove it anyway. However if the plasma type > chosen made wirebonding worse it also screwed solderability. We put this down to the fact that > the plasma was chewing off organics and then allowing them to be re-deposited. As this was a > side issue and not the object of the exercise it was not investigated and remained a surmised > comment in the footnotes. > > Hope this helps. > > Mike > > ----- Original Message ----- > From: Brian Ellis <[log in to unmask]> > To: <[log in to unmask]> > Sent: Thursday, April 27, 2000 11:41 AM > Subject: Re: [TN] Solderability > > > Raj > > > > No, but it's an interesting thought. I should imagine that some types of > > plasma could be quite active towards oxidising base metals. > > > > Brian > > > > Rajkumar wrote: > > > > > Hello everyone Hope everyone had a good easter break. I need to know, > > > if anyone is working on solderability degradation after plasma > > > cleaning? RegardsRajkumar > > > > ############################################################## > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > > ############################################################## > > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > ############################################################## > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > > information. > > If you need assistance - contact Keach Sasamori at [log in to unmask] or > > 847-509-9700 ext.5315 > > ############################################################## > > > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################