A few years ago, I saw wafer bumping machine using molten metal jet . This technology was developed by MPM corporation which is screen printer vender. However, recently I haven't heard any informations about metal jet bumping. Does anyone know that this technology is available now for wafer CSP? Thanks in advance. -------------- Fumiaki Shigeoka ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################