Frank, First, Is this a total range of 4-5 micron? That does not sound like a HAL specification. Since your problem seems to be related to hole plugging, I suspect the range is wider for the thickness. In this thickness range, I would not expect hole plugging to be a typical problem. What is the dimension of the connector fingers you are trying to coat? What is the Thickness of the Panel? What size holes are you having trouble clearing? The HAL equipment/process could be a factor. I am a member of a Hal Users Group (HUG)that has done extensive testing on various types of HAL and the results show that All HAL IS NOT EQUAL. Please contact me off line if you would like copies of the data and a paper given summarizing the capability call " A STUDY OF SOLDER THICKNESS UNIFORMITY FROM THE HOT AIR LEVELING PROCESS" which summarizes the results of the testing on various HAL equipment and "The Benefits of Angle" which describes the variations in thickness distributions seen with different processing angles through HAL. It may be of benefit to visit the following websites for more HAL capability information www.huggroup.org and www.tet-halco.com I would be happy to work with you (and your customer, if needed)to meet your customers requirements. We have in-house capability to evaluate special requirements and process panels. Please contact myself or Ray Dubois ([log in to unmask]) off-line if we can be of assistance. Sherry Goodell Applications Eng. Mgr. TET Halco 8 Delta Drive, Londonderry, NH 03053 P 603/437-8653 F 603/434-4156 E-Mail [log in to unmask] or [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Frank Davies Sent: Tuesday, April 18, 2000 6:56 AM To: [log in to unmask] Subject: [TN] Solder Leveling (HAL) Customer would like to have 4 to 5 microns of solder on the surface of his board after HAL.The area with most concern looks like contact fingers. Having trouble doing this without plugging holes. Any ideas or help would be appriciated frank