Hello TechNet: We've just ran our first production board designed with double sided SMT components. Everything worked well (bottom side components actually stayed on!) except for one thing. During the second reflow operation, some of the 0402s on the bottom tombstoned. These all soldered fine the first time around. My first thought is to raise the heat slightly, but I thought I'd check with you guys/girls first. Any recommendations? Thanks, Jim M. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################