Hello TechNet:

We've just ran our first production board designed with double sided SMT
components.  Everything worked well (bottom side components actually stayed
on!) except for one thing.  During the second reflow operation, some of the
0402s on the bottom tombstoned.  These all soldered fine the first time
around.  My first thought is to raise the heat slightly, but I thought I'd
check with you guys/girls first.  Any recommendations?

Thanks,
Jim M.

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