Excuse my ignorance, but could someone please explain What is :...electrolytic "strike plate" TIA Mickey Weiner > -----Original Message----- > From: Mike Bailey [SMTP:[log in to unmask]] > Sent: Mon April 10 2000 17:30 > To: [log in to unmask] > Subject: [TN] Double Electroless Processing > > We have long had a practice regarding the processing of thick panels with > high aspect ratio holes. We perform standard desmear/electroless > deposition > followed by a 10 min electrolytic strike plate. We then re-process the > panels through electroless copper. This has served us well in terms of > protection from "bubble" voiding, but has become burdensome on our pattern > cu throughput. In all honesty, we have not seen bubble voids, but are > probably a bit paranoid and hesitant to break the habit. The logic of > this > process has been that if you must re-process the panels, why subject > 99.99% > of the holes to additional electroless. It seemed better to lock them in > with a strike plate first. > > Anyway, I was in a meeting the other day and it was suggested that we > simply > re-process the panels a 2nd time thorough electroless copper and eliminate > the strike plate altogether. Being the composed individual that I am, I > bit > my tongue, but was thinking. WHAT PART OF INTERCONNECT INTEGRITY DON'T YOU > UNDERSTAND????? > > While I know that we have all done this double pass at one time or > another, > and it probably appeared to work satisfactorily, you must admit that the > main objective at the time was just to get the panels through and avoid > scrapping them at that point. > > I would appreciate a reality check and some feedback on this issue. > > Thanks in advance > > > Mike Bailey > Director of Engineering > McCurdy Circuits Inc. > 4900 E. Hunter Ave. > Anaheim, CA 92870 > Phone: 714 507-4900 Ext 253 > FAX: 714 507-4911 > e-mail: [log in to unmask] <mailto:[log in to unmask]> > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################