Stephen, The only spec that I am aware of giving plating roughness requirements is for the copper foil itself, not for anything plated on it. It is the IPC-MF-150. Of course, if the gold is only 20 microinches thick, any roughness greater than that is due to the underlying metal-- possibly the nickel, and probably the copper. And that is a pretty negligible roughness...20 microinch = approx. 0.5 microns. The spec. for very low profile (the best) is 5.1 micron max. roughness. Tim Reeves > ---------- > From: Stephen Ayotte > Sent: Thursday, April 6, 2000 5:41 > Subject: Gold Roughness > > For printed circuit boards is there and IPC specification for the allowed > roughness of the plated gold on top of a copper feature. If so what spec > is that in? > > thx. > > Stephen Ayotte, MD Manufacturing Quality Engineer > Bldg. 966-2, Office 2J1309, Dept. N62V > Essex Junction, Vt 05452 > Phone: External - 802-769-4775, tieline - 8-446-4775 > Pager: External - 802-878-5386 Pin # 4685, Internal - 74685 > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################