Stephen,
The only spec that I am aware of giving plating roughness requirements is
for the copper foil itself, not for anything plated on it. It is the
IPC-MF-150. Of course, if the gold is only 20 microinches thick, any
roughness greater than that is due to the underlying metal-- possibly the
nickel, and probably the copper. And that is a pretty negligible
roughness...20 microinch = approx. 0.5 microns. The spec. for very low
profile (the best) is 5.1 micron max. roughness.
Tim Reeves

> ----------
> From:         Stephen Ayotte
> Sent:         Thursday, April 6, 2000 5:41
> Subject:      Gold Roughness
>
> For printed circuit boards is there and IPC specification for the allowed
> roughness of the plated gold on top of a copper feature.  If so what spec
> is that in?
>
> thx.
>
> Stephen Ayotte, MD Manufacturing Quality Engineer
> Bldg. 966-2, Office 2J1309, Dept. N62V
> Essex Junction,   Vt  05452
> Phone:  External - 802-769-4775, tieline - 8-446-4775
> Pager:  External - 802-878-5386 Pin # 4685, Internal - 74685
>

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