Jim I believe in this case the practice will be worth then theory. Why not take a sample board and pass trough the reflow oven without the glue and see what happens ? Even with theory you will have to check if it really works doing the same thing. All situations where the force is near of the theoriticall value ( plus or minor ) you also have to check because theory and practice not always are the same ... I hope this help. Jorge Dourado de Santana Maintenance / Process Engr Microtec - Brazil > -----Original Message----- > From: Jim Faulkner [SMTP:[log in to unmask]] > Sent: 1 de Março de 2000 13:00 > To: [log in to unmask] > Subject: [TN] Double sided reflow > > I am looking for an equation that calculates the holding force of solder > paste for a given component. Meaning the holding force required to hold a > part on a board during bottom side reflow for SMT. We are trying to > determine when we need to glue. As of right now we glue most of our > components to the board but would like to reduce that number. Any > information you could share with me on this would be greatly appreicated. > ______________________________________________________ > Get Your Private, Free Email at http://www.hotmail.com > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################