I've been using .200" around BGA's. However - We have broken that rule and placed decoupling caps within the .200 keepout (only for designs with comp. on top side). The contract manufacturer know to remove the caps before reworking the BGA - remember only caps! No ICs or large tantulums. If the design has component on both sides then keeping the .200 keep out shouldn't be an issue. My 2 cent. Dennis Ward Net To Net Technologies ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################