Mornin' Kelly & All - The first step is to get the details of exactly what silicone is being used on this part from it's manufacturer - the resin formulation is critical to determining the appropriate adhesive. The second step is to contact applications engineering at one of the major silicone resin formulators (possibly the supplier of the resin used in this SRAM). Provide them the information regarding the parts resin composition, and the details of your heatsink (materials and finish). They will also need to know your intended use environment - your own engineering department will have to assist on determining adequacy of bond strength, etc., once compatible materials have been recommended. A word of caution: silicone adhesives are not noted for having tremendously high bond strengths. Regards - Kelly -----Original Message----- From: Kelly Kovalovsky <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Friday, March 03, 2000 12:20 PM Subject: [TN] SRAM Heatsink Attach >We are using an SRAM that is manufactured with a silicone based material. >The silicone acts as a mold release during component manufacture. We are >having problems coming up with a consistent process for attaching a >heatsink to this component and I understand it is due to the silicone. > >Does anyone have any process suggestions for this situation? I am thinking >in terms of various adhesive materials. I would like to avoid changing the >component. > >Kelly Kovalovsky > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################