Good afternoon everyone, Problem of the day. I'm trying to use a conventional via with a .8mm pitch microBGA. The spacing between the soldermask clearance around the land pad to the via pad is 2.7 mils. The via is cover with soldermask. What sort of problems should I expect with this situation? Will there be a problem? The via and land pad are not necessarily part of the same net. In case any one is interested the board parameters .093 thick board - 10 layers 13 mil via - 23 mils pad BGA - 9X9 .8mm pitch BGA ball size @.45mm (17.7 mils) BGA land pad @12 mils - 16 mil mask opening SMOBC LPI mask Any input appreciated! Dennis Ward Net to Net Technologies, Inc. 603 427-0600 [log in to unmask] http://www.nettonettech.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################