The IPC Imaging/Developing Subcommittee (4-13) has organized a discussion
group
during the Spring IPC EXPO in San Diego on "Developing Photoresists for Fine
Line Applications".

The IPC Plating Subcommittee (4-14)  welcomes all PCB manufacturers, who wish
to be involved in the creation of a "Gold Standard" to replace the defunct
Mil Spec.

Mike Toben who is heading the same effort for the ASTM will share with the
group where that team is to-day. Ideally IPC, MilSpec and ASTM would be in
agreement.

The meeting is scheduled for Monday April 3 from 1:30 to 3:00 pm in
conjunction with the IPC-Expo in San Diego.  The meeting location will be in
the final program in the Committee Meeting section.
Subcommittee Chair
George Milad
Shipley Co.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################