The IPC Imaging/Developing Subcommittee (4-13) has organized a discussion group during the Spring IPC EXPO in San Diego on "Developing Photoresists for Fine Line Applications". The IPC Plating Subcommittee (4-14) welcomes all PCB manufacturers, who wish to be involved in the creation of a "Gold Standard" to replace the defunct Mil Spec. Mike Toben who is heading the same effort for the ASTM will share with the group where that team is to-day. Ideally IPC, MilSpec and ASTM would be in agreement. The meeting is scheduled for Monday April 3 from 1:30 to 3:00 pm in conjunction with the IPC-Expo in San Diego. The meeting location will be in the final program in the Committee Meeting section. Subcommittee Chair George Milad Shipley Co. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################