Good morning Nancy Thank you very much for your help. I really need the table 6-1. would you please fax for me. Facsimile : 61 2 9748 7065 ----- Original Message ----- From: Nancy Trumbull <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, March 22, 2000 6:07 AM Subject: Re: [TN] Solder Ball Hi Van Per IPC 610C page A-1 Electrical Clearance The minimum spacing between conductors between conductive patterns, layer to layer conductive spaces ( z axis ) and between conductive materials ( such as conductive markings or mounting hardware ) and conductors shall be in accordance with Table 6-1. If needed let me know and I'll fax it to you. Again from 610c page 6-23 Entrapped / encapsulated / attached is intended to mean normal service environment of the product will not cause a solder ball to become dislodged. Testing would be a customer standard. As: vibration, reliability. shipping................ so on so on. Please remember the words entrap and encapsulate and what they mean. Hope this helped There's my two cents again Nancy T >>> Van Hoang Dinh <[log in to unmask]> 03/20/00 04:16PM >>> Good morning all, 1.Anyone known where can I look for a definition of ELECTRICAL DESIGN CLEARANCE ? 2.How we define or experiment test to prove that the solder balls are entrapped and not cause a solder ball to become dislodged? THANKS ALL VAN ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################