I agree with Werner Engelmaier. I also suggest that you take into account the soldering atmosphere. For example, if your equipment can operate with nitrogen or air, you may wish to document the processing atmosphere. My recommendation is that you run in nitrogen, whether or not you use IR Reflow or Convection. It will yield cleaner solder joints, with less visible residues, and improve solderability. This is especially true when running Pb-Free solders. Lee Whiteman Senior Manufacturing Engineer ACI / EMPF Telephone: (610) 362-1200; Ext. 208 FAX: (610) 362-1290 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Friday, March 17, 2000 2:54 PM To: [log in to unmask] Subject: Re: [TN] Oven Profile Recommendations? Hi Rick, Determining and maintaining reflow oven profiles for each assembly is a good idea regardless of the reflow method used (excepting vapor phase, of course). While the heat transfer has improved with the 'Convection' ovens vs. the 'IR' ovens, the size and thermal masses of components have gotten more varied. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################