~laughing~ Franklin ----- Original Message ----- From: Paul Klasek <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, March 15, 2000 8:12 PM Subject: Re: [TN] ??: [TN] Gold Removal > Understandable, no point of holding back being full of it........ > > -----Original Message----- > From: Howieson, Rick [mailto:[log in to unmask]] > Sent: Thursday, 16 March 2000 13:09 > To: [log in to unmask] > Subject: Re: [TN] ??: [TN] Gold Removal > > > Methane, amen. Here goes this one........ > > >-----Original Message----- > >From: Paul Klasek [SMTP:[log in to unmask]] > >Sent: Wednesday, March 15, 2000 6:04 PM > >To: [log in to unmask] > >Subject: Re: [TN] ??: [TN] Gold Removal > > > >Oh, gee, ehm, Ryan, mate, close, not sure if enough : > >1 > >Steve's maths ?(sorry Steve, you ARE one of the LEGENDS): > >"nearly" 75u" = 1.875um (or close enough); > >is NOT in line with ITRI's recommended 1.5um ceiling : > >me the coward never had guts to digest even 1um on soldered pads . > >I'll give you; with latest pad size trends (smaller); you may creep touch > >higher, > >but i do know if i'd got totally stoned and placed more than 1umAu on > specs, > >my fellow in QA would be after my skin . > >Besides, Tim 's been just quizzing me where the hell do i squeeze 0.5um > from > >flush; > >whining bitterly all he gets from his fabs is 0.25um tops on flash . > >Record i MEASURED on flash was some 0.8um, > >so i presume it's my turn in Tim's shoes : > >Where would you get saturation's which throws 75u" on Ni ? > >Presume only academic maths ? > > > >And the bible talks, i think (?) about 4% , not 3, > >but i won't be making scenes about that one > >(less is better, almost, hahaha) > > > >And NiAu (0.5umAu average = 20u") costs us less than HASL . > > > >Getting gold ears from all this off hip traffic ; > >getting dark here too: Inge : deleted some dozen methaned messages today ! > > > >All in good humor Ryan , ok ?, just let's retain the functionality. > > > > > >Paul > > > >-----Original Message----- > >From: Ryan Grant [mailto:[log in to unmask]] > >Sent: Thursday, 16 March 2000 10:47 > >To: [log in to unmask] > >Subject: Re: [TN] ??: [TN] Gold Removal > > > > > >I agree with this. Do the math. If a five mil stencil is used, and the > >component leads are NOT gold plated, the board gold thickness can reach > >nearly 75 micro inches before the percentage of gold in the joint reaches > >the magical number of 3%. Below 3%, gold is not shown to induce > >embrittlement. If you are soldering to BGA balls, there is even more Tin > to > >dilute the gold, so the gold thickness can be even thicker. The reason for > >the 5 to 8 micro inches of gold thickness is, that is the MINIMUM needed to > >prevent oxidation of the nickel. Thicker gold is more expensive in terms > of > >processing and material cost, and it is unnecessary, so why do it? > > > >Of course, if I buy a new stereo, and it has a scratch on it, I'll take it > >back. Functionality be damned. Rick can do the same with his boards. > > > >Ryan G. > > > >> -----Original Message----- > >> From: Timothy Reeves [SMTP:[log in to unmask]] > >> Sent: Wednesday, March 15, 2000 3:08 PM > >> To: [log in to unmask] > >> Subject: Re: [TN] ??: [TN] Gold Removal > >> > >> Does anyone agree with this? I hope not. > >> > >> > ---------- > >> > From: Jonathan A Noquil > >> > Sent: Tuesday, March 14, 2000 15:57 > >> > Subject: Re: ??: [TN] Gold Removal > >> > > >> > Higher gold thickness does not affect > >> > reliability (solderability), > >> > >> ############################################################## > >> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > >> ############################################################## > >> To subscribe/unsubscribe, send a message to [log in to unmask] with > >> following text in > >> the body: > >> To subscribe: SUBSCRIBE TECHNET <your full name> > >> To unsubscribe: SIGNOFF TECHNET > >> ############################################################## > >> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > >> additional > >> information. > >> If you need assistance - contact Keach Sasamori at [log in to unmask] or > >> 847-509-9700 ext.5315 > >> ############################################################## > > > >############################################################## > >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > >############################################################## > >To subscribe/unsubscribe, send a message to [log in to unmask] with following > >text in > >the body: > >To subscribe: SUBSCRIBE TECHNET <your full name> > >To unsubscribe: SIGNOFF TECHNET > >############################################################## > >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > >information. > >If you need assistance - contact Keach Sasamori at [log in to unmask] or > >847-509-9700 ext.5315 > >############################################################## > > > >############################################################## > >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > >############################################################## > >To subscribe/unsubscribe, send a message to [log in to unmask] with following > >text in > >the body: > >To subscribe: SUBSCRIBE TECHNET <your full name> > >To unsubscribe: SIGNOFF TECHNET > >############################################################## > >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > >information. > >If you need assistance - contact Keach Sasamori at [log in to unmask] or > >847-509-9700 ext.5315 > >############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. 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