We are using an SRAM that is manufactured with a silicone based material. The silicone acts as a mold release during component manufacture. We are having problems coming up with a consistent process for attaching a heatsink to this component and I understand it is due to the silicone. Does anyone have any process suggestions for this situation? I am thinking in terms of various adhesive materials. I would like to avoid changing the component. Kelly Kovalovsky ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################