Hi Rick, I asked about this subject recently and got only a few replies, but was advised to look at the TechNet archives and I found quite a bit there. Use keywords like via, fill, plug, tent, etc. Must say I didn't see much in the way of specs or standards though. Good luck! Tim Reeves > ---------- > From: Rick Babyak > Sent: Friday, March 31, 2000 4:46 > Subject: via plugging > > Is there any acceptance criteria or a spec out there that covers via > plugging with mask/ink? > > > > Rick Babyak > Process Engineer > Proto Circuit Inc. > 7 Ascot Parkway > Cuyahoga Falls, OH 44223 > 330-572-3401 Fax:330-572-3434 > [log in to unmask] > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################