Hello Guys,

I have experienced non-wet on the following plated surface:

1. Electroless Ni-P (P=10 %)
2. Electroless Ni-P (P=12 %)
3. Electroless Ni-AU (Au=0.02, Ni=3 to 5)
4. eLEctroless  Ni-B

the above plating finish were subjected to the following temp.

mold=175 C
then steam aging @ 4 hours, 8 hours, then 24 hours. All surfaces had now
wetting.

Does anyone have experience on the above problem

Your inputs are highly appreciated

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