Hello Guys, I have experienced non-wet on the following plated surface: 1. Electroless Ni-P (P=10 %) 2. Electroless Ni-P (P=12 %) 3. Electroless Ni-AU (Au=0.02, Ni=3 to 5) 4. eLEctroless Ni-B the above plating finish were subjected to the following temp. mold=175 C then steam aging @ 4 hours, 8 hours, then 24 hours. All surfaces had now wetting. Does anyone have experience on the above problem Your inputs are highly appreciated ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################