Ken, First I don't think you really mean to say the part leads are made with eutectic solder or Alloy 42. The leads are either Alloy 42 or copper, with a lead finish of eutectic solder, other tin/lead solder alloy or maybe even TI palladium. So you have sufficient pads size for good fillets, good soldering of other parts, good profile and heel fillets. Hmmm. My question would then be, do the failures look like the lead has pulled right out of the fillet, with bare lead frame material showing. If this is the case and the leads are indeed Alloy 42, then this has been seen before, is related to the final processing of the Alloy 42 and I think has been discussed here on TechNet. Check the archives. regards, Bev Christian XLTEK -----Original Message----- From: Ken Patel [mailto:[log in to unmask]] Sent: March 28, 2000 1:27 PM To: [log in to unmask] Subject: [TN] Solderability of TSOP... Guys, We have encountered problem related to component solderability, looks like! We are using Cypress Semi TSOP (SRAM-SM 71016 64kx16, ASYNC TSOP-44). This part has very small foot area which make a direct contact with the pad on the boards. The problem we have encountered is that many boards fail at ICT but will pass once we touch it up using solder iron. Solder at the TSOP location looks good and also in the surrounding vicinity. I do not see any profile problem. There is no toe fillet but I can see the heel filet rising on the lead. Pads are designed longer so that parts made by others can fit too. What can be possible causes of the problem? I tried look at the WEB but looks like parts are made using eutectic solder and not Alloy 42 but can't ruled out it was not specifically mentioned. re, ken patel ______________________________________________________ Ken Patel Phone: (408) 490-6804 1708 McCarthy Blvd. Fax: (408) 490-6859 Milpitas, CA 95035 Beeper: (888) 769-1808 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################