Our boards are primarily fine pitch surface mount. We currently have a problem with the height of the solder mask over our via's being too high causing the solder stencil not to sit flat to the board. The height of the vias solder mask included) are 4 mils higher than the rest of the board (including solder mask I believe the actual problem is that we have the vias filled with epoxy and the height of the epoxy in relation to the top of the via pad is too high. Is there a spec (IPC,JEDIC,MIL) that covers such an issue? If not, what do others spec out to insure that there is no interference from "lumps". Thank you. Best Regards, Mike Forrester LeCroy Corp. [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################