Hi Technetters; I'm evaluating some no clean solder paste, and I need some advice. I have reflown samples on some OSP coated coupons. Before and after measurements have given me a relative scale of which pastes wet better than others. That is what I like to see. Except that these are no cleans. Which means, better wetting on OSP = higher activity. The number of different board types and materials involved are so numerous, I can't practically send a proper representative of production boards out for SIR testing on my own. (We are a CEM). All of these paste have passed BellCore and IPC SIR requirements. All product is class II. So can I accept the best wetting paste, should I go with the least wetting paste, or go middle line? What is your opinion of the most practical way of balancing the processing window of wetting Vs reliability? Thanks for you help Ryan Grant MCMS Process Development ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################