I would like to get a new copy of IPC 7095. Who is the chairperson for that committee? Thanks, M. Yuen -----Original Message----- From: Gabriela Bogdan [mailto:[log in to unmask]] Sent: Monday, March 20, 2000 4:43 PM To: [log in to unmask] Subject: Re: [TN] Voids in BGA Balls after reflow Bob, You can search the TechNet archives for voids in BGA solder balls. Max .allowed voids is about 20% of the ball volume, if I remember well from the draft of IPC7095. Bad thing is when the voids are at the interface between ball and component pad or board. I have also a "High end" x-ray equipment, and to my great amusement I can make voids appear , disappear and grow depending on voltage and current. Make sure that your picture is not "overworked" and that what you see is the real thing. If it is, it seems bad to me. Just for comparison, you can perform a cross section on a ball with big voids. Gaby Bob Perkins wrote: > Hello Technetters > > Recently with the help of a high end piece of x-ray equipment we > have noticed voids in the spheres of the bga after reflow, "see > attachment-file". Has anyone seen this before, or has any idea how the > voids are created? Also does anyone know if this is a bad or good thing? > Does anyone have any recommendations to the profile? > > Thanks > Bob Perkins > Automation Technician/Manufacturing Engineer > Aimtronics > [log in to unmask] > > <<wboard6.jpg>> > > ------------------------------------------------------------------------ > Name: wboard6.jpg > wboard6.jpg Type: JPEG Image (image/jpeg) > Encoding: base64 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################