> Hi,
> This is the first time I'm using a micro BGA package (256 lead,pitch 1mm)
> below are some of my questions that anyone help me.
> 1) What  pad size to use for a good solder joint?
> 2) What is the best way to route and layers needed? Also the most cost
> saving example microvia,blind/burried via ?
> 3) what trace width to use ?
> 4) Is it possible to route this BGA without using any via on pads ?
> 5) What are the instruction for pcb manufacturer.
> 6) Any one who have design this type of bga that can share your package or
> show me your design. ( I'm a Pads user)
> Tia.
>
> Best Regards,
> EILEEN ONG (R&D Dept.)
> Paradise Innovations (Asia) Pte Ltd
> 25 Serangoon North Ave 5
> 6th floor Uraco Building
> Singapore 554914
> Did: (65) 485-6690 (Office)
> Fax: (65) 481-2611
> Email : mailto:[log in to unmask]
> Web: http://www.paradisemmp.com
>
>