I'm still wondering what the application is. Why would you want only 6-10 microinches of gold unless you're wire bonding and you need soft gold, where immersion Au is just right? If it's an application that needs hard gold, why only 6-10 microinches? > ---------- > From: Hollandsworth, Ron > Sent: Tuesday, March 14, 2000 10:18 > Subject: Gold Removal > > Rick Howieson & Others: > Rick, you ask how thick our gold was . . . I misled everyone in the type > of > plating . . . it's not immersion but rather electroplating. Our spec is > 6-10 and we are getting or got, 20-30 on some boards. These are the > boards > we would like to remove some gold if possible. > > I understand that electroplating your thickness depends on time rather > than > ion for ion in immersion plating. > > Thanks > Ron > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################