> Hi, > This is the first time I'm using a micro BGA package (256 lead,pitch 1mm) > below are some of my questions that anyone help me. > 1) What pad size to use for a good solder joint? > 2) What is the best way to route and layers needed? Also the most cost > saving example microvia,blind/burried via ? > 3) what trace width to use ? > 4) Is it possible to route this BGA without using any via on pads ? > 5) What are the instruction for pcb manufacturer. > 6) Any one who have design this type of bga that can share your package or > show me your design. ( I'm a Pads user) > Tia. > > Best Regards, > EILEEN ONG (R&D Dept.) > Paradise Innovations (Asia) Pte Ltd > 25 Serangoon North Ave 5 > 6th floor Uraco Building > Singapore 554914 > Did: (65) 485-6690 (Office) > Fax: (65) 481-2611 > Email : mailto:[log in to unmask] > Web: http://www.paradisemmp.com > >