Technet,
I have recently read
in an article that the most favourable type of solder joint is formed from rapid
cooling of the solder.
I am a bit confused
with this as I have always been under the impression that rapid cooling of
metals results in tight compact grain structures (very hard, but brittle). This
is in contrast to slow cooling that forms long grain structures resulting
in a stronger and tougher material (which I would have thought is what would be
ideal for a solder joint - good shock resistance).
Regards....
Clayton
Gardner
Engineering Manager