TechNet,
I would like to
hear the Forum's opinions about pre-cleaning before soldermask (both Dry Film
and LPI), in particular about the methods based on chemical rather than
mechanical action.
We are evaluating
an "oxide replacement" chemistry versus different microetch chem-clean
systems. The microetch would be our preference because running thick
panels through our oxide replacement equipment may result in damage to the line,
of course we are getting good results from the oxide replacement chemistry but
we are not getting consistent results from the chem-cleaning
process.
Also I would like
to know what other PCB manufacturers are doing when they are not using
mechanical scrubbing methods.
Any suggestions
regarding chemistry and/or process parameters would be greatly
appreciated.
Thanks in
advance
adeodato vigano
compunetics, inc. - pcb
division
phone: 412.858.6115
fax: 412.858.8060