Susan, such THT-to-SMT modifications should meet J-STD-001B, § 6.5.2  or
IPC-A-610B, § 5.3.1. 
Bernhard

> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Monday, February 21, 2000 16:33
> To: [log in to unmask]
> Subject: [TN] ASSY: PTH -> SMT
> 
> 
> Lately I have been seeing failure analysis that indicates the failures
> were caused by trying to take a through hole component and bending
> the leads up and around or under the component body to make it
> a surface mount component.  In one case a crystal seal was broken
> and another the bends were just too "springy".
> 
> Is there a set of suggestions as to how and when and IF this can be
> done to a through hole component?
> 
> Susan Mansilla
> Technical Director
> Robisan Lab
> 
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