Steve,
 
My initial reaction to your comments are that the fabricator has liquid leaking back out of the vias after curing.
 
I'll explain why I believe this:
I have seen this happen a few times here at our place.
 
Keep in mind I am basing this solely on the information available, I could be way off base...
 
Curious to know how this evolves though...
 
Franklin D Asbell
 
----- Original Message -----
From: Stephen R. Gregory <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 11, 2000 8:12 AM
Subject: [TN] Solder mask failing tape test..

> Mornin' all!!
>
> This morning I got a email from one of our buyers telling me that one of the
> boards at one of our fab shops is being held-up because it doesn't pass their
> solder mask tape test. My buyer said that they told him that the mask is only
> coming off the via's, and it was because of uncured mask. The mask is a LPI
> and the via's aren't meant to be tented. Also the board doesn't go through
> wave solder as the only through-hole is hand soldered because it goes up
> through the board from the bottomside.
>
> My buyer is asking me if we should accept the boards. I have a few concerns.
> One thing is that if there is uncured mask at the via's, what guarantees are
> there that there isn't more at other places on the board? Shouldn't uncured
> mask be a simple thing to fix by either baking the PCB (if it's a thermal
> cure), or exposing it to more UV (if it's a UV cure)?
>
> Further still, does uncured mask come off in a tape test? Or is mask coming
> off from a tape test more an indication of an adhesion problem from
> contamination?
>
> Thanks in advance for all replies,
>
> -Steve Gregory-
>
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